My machines are called Dicing Saws. I calibrate these machines to seperate individual die on silicon wafers, glass or ceramic. These tools are used in the semiconductor industry. Usually when I cut silicon, dependending on the thickness of the material I use blades that are diamond impregnated nickel that can range from .0007"-.004" thick. Pretty fragile blades until you rotate them at 40,000 rpm. These machines with encoder feedback can repeat an exact index across 8" span within 1/4 micron. Pretty amazing stuff. Check out our website
www.eartechnology.com You can see these machines here.
